Optical caliper for 3-d endoscopic imaging and measurement

ABSTRACT

A system for an endoscope includes a camera head coupled to an optical channel. The system also includes a light port coupled to the endoscope and configured to receive a first light ray, wherein the first light ray travels through a first optical path along an optical axis of the optical channel. The system also includes a depth measurement module coupled to the endoscope, wherein the depth measurement module is configured to transmit a second light ray through a second optical path along the optical axis. The system also includes an image sensor coupled to the camera head and configured to receive a first set of images pertaining to the first light ray and a second set of images pertaining to the second light ray. The system also includes a processing device configured to use the first and second sets of images to generate one or more 3-D images.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to and the benefit of U.S. ProvisionalPatent Application Ser. No. 63/082,056, filed Sep. 23, 2020, titled“Optical Caliper for 3-D Endoscopic Imaging and Measurement,” the entiredisclosure of which is hereby incorporated by reference for allpurposes.

BACKGROUND

An endoscope is a tool that provides visualization of a structure insidethe body of a patient during a medical procedure, including a minimallyinvasive surgery. The endoscope can be used to examine a surface of thestructure, cavities, channels, and recesses of the structure. A lightingsystem can be used to illuminate the structures. An imaging system canbe used to capture, as an image, the information contained in the lightreflected by the surface. The images captured by the endoscope can bedisplayed on a display unit, such as a monitor or screen, for a medicalprofessional to view in real-time or near real-time.

SUMMARY

In general, the present disclosure provides systems and methods for 3-Dendoscopic imaging and measurement.

An aspect of the disclosed embodiments includes a system for anendoscope. The system also includes a camera head coupled to an opticalchannel. The system also includes a light port coupled to the endoscopeand configured to receive a first light ray, wherein the first light raytravels through a first optical path along an optical axis of theoptical channel. The system also includes a depth measurement modulecoupled to the endoscope, wherein the depth measurement module isconfigured to transmit a second light ray through a second optical pathalong the optical axis. The system also includes an image sensor coupledto the camera head and configured to receive a first set of imagespertaining to the first light ray and a second set of images pertainingto the second light ray. The system also includes a processing deviceconfigured to receive the first and second sets of images from the imagesensor and use the first and second sets of images to generate one ormore 3-D images.

Another aspect of the disclosed embodiments includes a method forgenerating a 3-D image of an object. The method includes transmitting afirst light ray through a first optical path along an optical axis of anoptical channel. The method also includes transmitting a second lightray through a second optical path along the optical axis. The methodalso includes receiving a first set of images captured by an imagesensor, wherein the first set of images pertain to the first light ray.The method also includes receiving a second set of images captured fromthe image sensor, wherein the second set of images pertain to the secondlight ray. The method also includes generating, using the first andsecond sets of images, 3-D image.

Another aspect of the disclosed embodiments includes a system for anendoscope. The system includes a camera head coupled to an opticalchannel. The system also includes a light port coupled to the endoscopeand configured to receive a first light ray, wherein the first light raytravels through a first optical path along an optical axis of theoptical channel. The system also includes a depth measurement modulecoupled to the endoscope, wherein the depth measurement module isconfigured to generate a grid pattern and transmit the grid pattern anda second light ray toward a beam splitter, wherein the beam splitter isconfigured to reflect at least a portion of the grid pattern and thesecond light ray through the optical axis. The system also includes animage sensor configured to receive a first set of images captured fromthe camera, wherein the first set of images pertain to the first lightray. The system also includes a second image sensor configured toreceive a second set of images captured from the camera, wherein thesecond set of images pertain to the second light ray. The system alsoincludes a processing device configured to receive the first and secondsets of images and the grid pattern from the image sensors and use thefirst and second sets of images and the grid pattern to generate one ormore 3-D images.

BRIEF DESCRIPTION OF THE DRAWINGS

For a detailed description of example embodiments, reference will now bemade to the accompanying drawings in which:

FIG. 1 shows a surgical system in accordance with at least someembodiments;

FIG. 2 shows a diagram of a system including an optical caliper inaccordance with at least some embodiments;

FIG. 3 shows a schematic diagram of the system in accordance with atleast some embodiments;

FIGS. 4A and 4B show schematics of a first grating at different focalpoints, respectively, in accordance with at least some embodiments;

FIG. 5A shows an image formed using the configuration of FIG. 4A andFIG. 5B shows a graph of a profile measured in a middle portion of theimage in accordance with at least some embodiments;

FIGS. 6A and 6C show images of gratings formed at different focal pointsof FIG. 4B and FIGS. 6B and 6D show graphs of the profiles measured atthe different focal points;

FIGS. 7A and 7B show schematics of a second grating in accordance withat least some embodiments;

FIG. 8A shows an image of the second grating of FIG. 7A that is formedin the plane of observation and FIG. 8B shows a graph of the profilemeasured in a middle portion of the image in accordance with at leastsome embodiments;

FIG. 9A shows an image of the second grating of FIG. 7B that is formed adistance from the plane of observation and FIG. 9B shows a graph of theprofile measured in a middle portion of the image in accordance with atleast some embodiments;

FIG. 10 shows a schematic of the first grating of FIG. 5A and a graph ofthe profiles measured in accordance with at least some embodiments;

FIG. 11A shows an image of the first grating that is formed fromobserving a curved surface below the axis and FIG. 11B shows a graph ofthe profile measured in a middle portion of the image in accordance withat least some embodiments;

FIG. 12 shows a schematic of the second grating in a first position inaccordance with at least some embodiments;

FIG. 13A shows an image of the second grating that is formed fromobserving a curved surface below the axis and FIG. 13B shows a graph ofthe profile measured in a middle portion of the image in accordance withat least some embodiments;

FIG. 14 shows a schematic of the second grating in a second position inaccordance with at least some embodiments;

FIG. 15A shows an image of the second grating that is formed fromobserving the curved surface focused below an apex and FIG. 15B shows agraph of the profile measured in a middle portion of the image inaccordance with at least some embodiments;

FIG. 16A shows an image of the second grating that is formed fromobserving the curved surface below the axis and FIG. 16B shows a graphof the profile measured in a middle portion of the image in accordancewith at least some embodiments;

FIG. 17 shows a schematic of a calculation pertaining to measurements oftwo points along a curved surface in accordance with at least someembodiments;

FIG. 18 shows different diffraction patterns observed various distancesalong the direction of propagation in accordance with at least someembodiments;

FIG. 19 shows a schematic of diffraction patterns observed betweenself-images for an opening ratio of 1/8;

FIG. 20 shows a computer system in accordance with at least someembodiments;

FIG. 21 shows a method of generating a 3-D image of an object inaccordance with at least some embodiments;

FIG. 22 shows a method of generating a 3-D image of an object inaccordance with at least some embodiments; and

FIG. 23 shows a method of rotating a display to generate a 3-D image ofan object in accordance with at least some embodiments.

DEFINITIONS

Various terms are used to refer to particular system components.Different companies may refer to a component by different names—thisdocument does not intend to distinguish between components that differin name but not function. In the following discussion and in the claims,the terms “including” and “comprising” are used in an open-endedfashion, and thus should be interpreted to mean “including, but notlimited to . . . ” Also, the term “couple” or “couples” is intended tomean either an indirect or direct connection. Thus, if a first devicecouples to a second device, that connection may be through a directconnection or through an indirect connection via other devices andconnections.

“Receiving . . . depth information” shall mean receiving data indicativeof a depth, a density, a grating, a location, a frequency, phaseinformation, or any other desired image data on a structure within acoordinate space (e.g., a coordinate space of a view of an endoscope).Thus, example systems and methods may “receive . . . depth information”being data indicative of a relative depth, density, grating, location,frequency, and/or phase information of the structure within a 3-Dcoordinate space.

Diffraction grating, or grating, shall mean an optical component with aperiodic structure that splits and diffracts light into several beamstravelling in different directions. The directions of these beams dependon the spacing of the grating and the wavelength of the light so thatthe grating acts as the dispersive element. A grid pattern is an arrayof squares or rectangles of substantially equal size.

An endoscope having “a single optical path” through an endoscope shallmean that the endoscope is not a stereoscopic endoscope having twodistinct optical paths separated by an interocular distance at the lightcollecting end of the endoscope. The fact that an endoscope has two ormore optical members (e.g., glass rods, optical fibers) forming a singleoptical path shall not obviate the status as a single optical path.

DETAILED DESCRIPTION

The following discussion is directed to various embodiments of theinvention. Although one or more of these embodiments may be preferred,the embodiments disclosed should not be interpreted, or otherwise used,as limiting the scope of the disclosure, including the claims. Inaddition, one skilled in the art will understand that the followingdescription has broad application, and the discussion of any embodimentis meant only to be exemplary of that embodiment, and not intended tointimate that the scope of the disclosure, including the claims, islimited to that embodiment.

Various examples are directed to systems and methods of 3-D endoscopicimaging and measurement. The endoscopic imaging and measurement can beperformed by a medical professional and/or be computer assisted.

FIG. 1 shows a surgical system (not to scale) in accordance with atleast some embodiments. In particular, the example surgical system 100comprises a tower or device cart 102, an example mechanical resectioninstrument 104, an example plasma-based ablation instrument (hereafterjust ablation instrument 106), and an endoscope 108 with an attachedcamera head 110, an integral light post 120, and an attached a depthmeasurement module 204. The device cart 102 may comprise a camera 112(illustratively shown as a stereoscopic camera), a display device 114, aresection controller 116, and a camera control unit (CCU) together withan endoscopic light source (e.g., a first light source 220) and a videocontroller 118. In example cases, the CCU, endoscopic light source, andvideo controller 118 provide light through the light post 120 to theendoscope 108 to illuminate the surgical field, and display imagesreceived from the camera head 110. The CCU, endoscopic light source, andvideo controller 118 also implement various additional aspects, such ascalibration of the endoscope 108 and the camera head 110, displayingplanned-tunnel paths and images on the display device 114, receiving 2-Dand 3-D images and grid patterns, calculating displacement of a focalpoint relative to a diffraction grating, adjusting a density of adiffraction grating to displace the focal point, and generating anddisplaying processed 3-D images. Thus, the CCU, endoscopic light source,and video controller is hereafter referred to as surgical controller118. In other cases, however, the CCU and video controller may be aseparate and distinct system from the controller that handles aspects ofintraoperative changes, yet the separate devices would nevertheless beoperationally coupled.

The example device cart 102 further includes a pump controller 122(e.g., single or dual peristaltic pump). Fluidic connections of themechanical resection instrument 104 and ablation instrument 106 are notshown so as not to unduly complicate the figure. Similarly, fluidicconnections between the pump controller 122 and the patient are notshown so as not to unduly complicate the figure. In the example system,both the mechanical resection instrument 104 and the ablation instrument106 are coupled to the resection controller 116 being a dual-functioncontroller. In other cases, however, there may be a mechanical resectioncontroller separate and distinct from an ablation controller. Theexample devices and controllers associated with the device cart 102 aremerely examples, and other examples include vacuum pumps,patient-positioning systems, robotic arms holding various instruments,ultrasonic cutting devices and related controllers, patient-positioningcontrollers, and robotic surgical systems.

The systems and methods disclosed herein can be used for monocular 3-Dvision through an endoscope. Specifically, the systems and methods canbe used to obtain 3-D images and perform topographic measurements fromendoscope images by employing the self-imaging effect and using asingle-channel image-forming system. The depth measurement module 204can be used to form self-images and provide depth information obtainedfrom the contrast of the self-images and measurements taken of thespacing between the lines of the grid pattern. The systems and methodsare configured to obtain information to generate a 3-D image of asurface of a structure, cavity, channel, and/or recess inside of apatient. For example, the system can perform topographic measurementsfrom endoscopic images and use a self-imaging effect (e.g., Talboteffect) to generate 3-D images.

FIG. 2 shows an example system 200 in accordance with at least someembodiments. FIG. 3 shows an example system 300, which includes asimplified schematic of the system 200 of FIG. 2, but rotated about avertical axis. Referring simultaneously to FIGS. 2 and 3. The system 200includes the endoscope 108 with its light port 120, the camera head 110,and the depth measurement module 204. The camera head 110 can be coupledat the proximal end of the endoscope 108. The camera head 110 cancomprise a reflector 206, such as a dichroic reflector. The camera head110 may comprise one or more image sensors 224. The one or more imagesensors 224 may be a Red/Green/Blue (R/G/B) sensor, an ultraviolet (UV)sensor, an infrared (IR) sensor, a charge-could device (CCD) array, anyother image sensor or combination thereof. The light port 120 may bedefined by endoscope 108 near the proximal end of the endoscope 108. Thelight port 120 is configured to receive a first light ray 222 (e.g.,visible light) from a first light source (such as the endoscopic lightsource within the surgical controller 118). The first light ray 222 maybe visible or white light illumination, and the visible or white lightreflected within the surgical site can be detected by an image sensor224 (e.g., the R/G/B sensor, CCD array). The first light ray 222 travelswithin the endoscope 108 along a first illumination path disposed in anoptical channel 216 along (e.g., parallel to) an optical axis 232, andemits out of the distal end of the endoscope 108 into the surgicalcavity (e.g., knee, shoulder). After reflection from surfaces within thesurgical cavity, the reflected first light ray 222′ may propagatethrough one or more lenses (e.g., objective lenses L2 and L3) coupledassociated with the endoscope 108 to arrive back at the camera head 110,and be captured by the image sensor 224.

The depth measurement module 204 can be coupled to the system 200between the endoscope 108 and the camera head 110, or at any othersuitable location. The depth measurement module 204 may comprise anotherlight source (e.g., a second light source 228), an objective lens L1, aLiquid Crystal Display (LCD) 320, a microcontroller 210, and a prism(e.g., a beam splitter BS). The second light source 228, the beamsplitter BS, the lens L1, the LCD 320, and the microcontroller 210 canbe disposed in a housing 234.

The second light source 228 may be a laser, a tunable laser, or anyother desired light source. The second light source 228 may light in thevisible spectrum or outside the visible spectrum (e.g., infrared (IR) orultraviolet (UV) lights), a coherent light that includes phaseinformation, a coherent light that can generate a periodic pattern, anyother desired light or combination thereof. The second light source 228and LCD 320 may be used to create a grid pattern within the surgicalsite, and reflections of the grid pattern from within the surgical sitemay be used to obtain information from which depth can be decoded viaimage processing for recognizing distortion, periodic patterns, and/orphase information.

The lens L1 may be disposed in the housing 234 between the second lightsource 228 and the LCD 320. For example, the lens L1 may be positioned adistance from the second light source 228 equal to the focal length ofthe lens L1. In this example, the lens L1 can collimate the second lightray 230 as it transmits through the lens L1.

The LCD 320 can be disposed in the housing 234 between the lens L1 andthe beam splitter BS. The microcontroller 210 can be operatively coupledto the LCD 320. The microcontroller 210 can be configured to display agrating 306 on the LCD 320 to generate grid patterns at one or moredifferent periods. The microcontroller 210 can be configured to changethe density of the grating and/or rotate the grating displayed on theLCD 320. The beam splitter BS can be disposed in the depth measurementmodule 204 at an angle, such as at a 45 degree angle from the secondillumination path 240.

The depth measurement module 204 can be configured to transmit thesecond light ray 230 from the second light source 228 through the lensL1 and the grating 306 formed by the LCD 320 and toward the beamsplitter BS, which reflects at least a portion of the second light ray230 to within the endoscope 108 along a second illumination path and outof the distal end of the endoscope 108. The second light ray 230 maytravel through one or more lens (e.g., lens L2 and lens L3). The depthmeasurement module 204 can be configured to transmit both the secondlight ray 230 (forming the structure lines of the grid pattern 236) intothe surgical space containing the object 310 (e.g., into a portion of apatient's knee or any other desired body part). A portion of the secondlight ray 230 is reflected (e.g., reflected second light ray 230′). Thereflected second light ray 230′ (e.g., a reflected distorted gridpattern 236′) travel through a second optical path 214 (e.g., a secondimage path) of the endoscope 108. The reflected second light ray 230′and the distorted grid pattern 236′ travel back through the lenses L3and L2, the beam splitter BS, an objective lens L4 (e.g., being part ofan eyepiece 316), and to the camera head 110. The beam splitter BS canbe configured to reflect diffracted light and form a self-image of thegrating on a plane (e.g., an OP₀ plane shown in FIG. 3). The imagesensor 224 can capture the distorted grid pattern 236′. If the secondlight ray 230 is in the visible spectrum, the image sensor 224 cancapture the reflected second light ray 230′. If the second light ray 230is outside the visible spectrum, a second image sensor (e.g., aspecialty sensor) capable of such detection can be used capture thereflected second light ray 230′. The second image sensor can be coupledand/or be part of the camera head 110.

The image sensor 224 can be configured to receive a first set of images218. The first set of images 218 may pertain to the first light ray 222.The image sensor 224 can be configured to receive a second set of images226. The second set of images 226 may pertain to the reflected secondlight ray 230′ comprising the reflected grid pattern 236′. The system200 further comprises a processing device 2002 (FIG. 20) communicativelycoupled to the system 200. As described in more detail herein, theprocessing device 2002 can be configured to receive and use the firstand second sets of images 218 and 226 (including the grid pattern 236′)from the image sensor 224 to generate one or more 3-D images.

In example systems and methods, the two optical paths 212, 214 are thesame optical channel 216. The first optical path 212 may be configuredfor regular imaging and for receiving 2-D planar images 218. The secondoptical path may be configured for 3-D imaging and receiving 3-D images226 and grid patterns 236′. Thus, in one example the first illuminationpath, along with the first light ray 222 travels, is a separate anddistinct optical path than the optical channel 216. Note, however, thatin some examples the second light ray 230 propagates to the surgicalsite along the optical channel 216, which optical channel 216 alsocarries the reflected first light ray 222′ and the reflected secondlight ray 230′. In other embodiments, the first optical path 212 isconfigured for depth imaging and the second optical path 214 isconfigured for regular imaging.

The processing device 2002 can measure the depth of a surface of anobject using depth information obtained from the second optical path 214(e.g., the depth measurement path). The processing device 2002 canreceive the depth information from the second optical path 214 withoutinterfering with any of the first set of images 218 (e.g., imagescreated from the reflected visible light) from the first optical path212. The second illumination path may include two sections: a firstsection 238 and a second section 240. The first section 238 may beperpendicular to the second section 240. The second section 240 of thesecond illumination path and the first illumination path may be disposedin the same optical channel 216.

In some embodiments, the system 200 uses the Talbot effect forself-imaging to obtain the depth measurement. The microcontroller 210 isconfigured to generate grid patterns or gratings at different periods(e.g., densities) by way of the LCD 320. Software run on themicrocontroller is configured to transmit instructions to rotate thegrid patterns or gratings by way of the LCD 320. The microcontroller 210can control diffraction grating in the camera head 110. For example, themicrocontroller can be configured to sweep the object for depthinformation and form lines at certain locations, for example, based onthe density of the grid patterns 236.

In some examples, the system 200 includes a glass for displaying a fixeddiffraction grating. In this example, the microcontroller 210 cancontrol a tunable laser (e.g., the second light source 228) to receivethe depth information. The microcontroller 210 can control the tunablelaser by varying the wavelength emitted. Alternatively, aninterchangeably fixed diffraction grating could be used and rotated. Inother examples, a micro-mirror array can be used to change a density ora light phase of the grating. The processing device 2002 can use theinformation obtained by the changes to generate 3-D images with higherresolution.

Regardless of precisely how created, the diffraction grating can be usedto generate a grid pattern 236 via its different orders of self-imaging(e.g., a Talbot carpet). The Talbot carpet can be generated via varioustypes of diffraction of grating. The Talbot effect with generatingself-imaging of the diffraction grating can function as a 3-Dprofilometer. In some examples, the first light ray 222 is a visiblelight detected by a visible light sensor 224 (e.g., an R/G/B sensor) andthe second light ray 230 is an infrared or an ultraviolet and themicrocontroller 210 generates structure lighting lines (e.g., the gridpattern 236). The grid pattern 236 is sent though the secondillumination path 240 to the surgical site (e.g., the object 310). Thegrid pattern 236 is reflected (at different depths within the surgicalsite) to create a distorted grid pattern 236′ detected by imaging sensor224. The processing device 2002 may create the 3-D image 226 bycombining the 2-D image 218 and the distorted grid pattern 236′.

In some examples, the second image sensor is configured to detect thestructured lighting lines (e.g., the grid pattern 236′). For example,the second image sensor may be an infrared sensor, an ultravioletsensor, or any other desired sensor. The second light ray 230 can be alight outside the visual spectrum, and therefore, does not interferewith the first light ray 222 in the visible spectrum. The processingdevice 2002 can use the reflected second light ray 230′ to generate animage using grid patterns 236′ not in the visible spectrum. In someexamples, the system 200 is configured to analyze phase information forphase information decoding, periodic patterns, and/or any other desiredimage information. In some examples, the system 200 uses a micro-mirrorarray for generating lines (e.g., a grid pattern 236) for depthinformation decoding.

Using one or more of the methods disclosed herein, the processing device2002 can process the received images to correct image distortion anddecode the depth information via calculation to generate 3-D images 226.The processing device 2002 can determine, using the spacing (e.g.,measurements of distance between lines of the grid pattern 246), thedepth and 3-D imaging. If an area of the image is blurred (e.g., has alow resolution), the processing device 2002 can refocus the image. Theprocessing device 2002 can measure the period of the grating and thecontrast to obtain additional information (e.g., depth information) onthe position of the object. The processing device 2002 can focus thegrid lines on an area and analyze the contrast and/or density to providean image with a higher resolution. The contrast lines can correlate to aspecific depth of the object. The system 200 can be configured toautofocus while sweeping the object to obtain depth information. Forexample, in an autofocus mode, the processing device 2002 can use phaseinformation (e.g., the phase of the outgoing refraction light) toautomatically focus. The processing device 2002 use the phaseinformation to facilitate focus and/or to generate images withadditional resolution. The microcontroller 210 can generate the gridpatterns 236 and, using the software, vary the grating of the gridpatterns 236. For example, the microcontroller 210 can change thedensity of the grating displayed on the LCD 320 and/or rotate thegrating on the LCD 320 about the optical axis 232 of the endoscope 108,or otherwise change the grating to capture additional image informationto generate the 3-D images. The resulting scan can include a full depthof the object and additional image information. For image processing,the system 200 can be integrated with the surgical controller 118 usingthe board integrated with the system 100.

Some examples pertain to using an artificial intelligence engine and/ormachine learning engine to generate images. For example, the processingdevice 2002 can be configured to generate, via an artificialintelligence engine, a machine learning model trained to generate imagedata based on at least one of the first and second sets of images 218,226. The artificial intelligence engine and/or machine learning enginemay be trained to change the density of the grating displayed on the LCD320 and/or rotate the grating on the LCD 320 about the optical axis ofthe endoscope 108, or otherwise change the grating to capture additionaldepth image information to generate the 3-D images. The artificialintelligence engine and/or machine learning engine can adjust theoptical system based on new learnings generated from analysis of thedepth information. For example, the artificial intelligence engineand/or machine learning engine may analyze, using gratings of differentspatial frequencies, the behavior of the self-images formed by theoptical components of the endoscope 108. The artificial intelligenceengine and/or machine learning engine may vary the distance between thegrating and the focal point to obtain additional depth information, suchas the density of the grating of the object, by analyzing the lines ofthe grid on the object. The methods and systems disclosed herein reducethe need for an additional cameral and/or an additional optical channelto obtain such information. The artificial intelligence engine and/ormachine learning engine can analyze the formation of the self-images onboth a flat object and a curved surface. The system 200 or any othersystems or methods described herein may be used in robotics-aidedmedical procedures.

FIGS. 2 and 3 are not intended to be limiting: the systems 200, 300 mayinclude more or fewer components than those illustrated.

Images on a Flat Surface

As illustrated in FIGS. 2-9B, the systems and methods can be used tomeasure distances between objects with flat surfaces. The depthmeasurement module 204 can be configured to use a diode laser 304emitting in the visible region of the electromagnetic spectrum (e.g.,λ=634.9 nm) to illuminate a grating 306 with a collimated wavefront,using the lens L1, on the LCD 320. The depth measurement module 204 usesthe beam splitter, BS, to direct light and form a self-image of thegrating 306 (e.g., the grid pattern 236) on an OP₀ plane. Optical relaysof the endoscope 108 (e.g., of lenses L2 and L3) are illustrated in anarea 308, each of which can be disposed at opposite ends of theendoscope 108. An objective lens 318 can be positioned adjacent to theOP₀ plane or any other desired location. The OP₀ plane represents anarea of an object 310, such as a knee of a patient that is undergoing amedical procedure (e.g., using the endoscope 108). As illustrated by thearrow 312, the endoscope 108 can be configured to form an image of theOP₀ plane on the OP′₀ plane.

The eyepiece 316 can be disposed at the proximal end of the endoscope108 and coupled to the camera head 110. The eyepiece 316 includes thelens L4. The lens L4 can be disposed a distance Si from an image sensor,shows as CCD 314 in FIG. 3. The CCD 314 may be a member of the camerahead 110. The lens L4 can be disposed a distance S₀ from the OP′₀ plane.The lens L4 can be configured to form the image of the OP′₀ plane on theCCD 314. The CCD 314 can be an integrated circuit etched onto a siliconsurface forming light sensitive elements (e.g. pixels). Photons strikingon this surface can generate charge that can be read by the processingdevice 2002 and turned into a digital copy of the light patterns fallingon the CCD 314. Thus, the OP₀ plane can be reflected in the OP′₀ outputplane.

FIG. 4A shows a configuration 400 of the objective lens 318 relative toa first focal point 404. In this example, the processing device 2002uses a first grating with a frequency of 98 lines/inch to generate aself-image 402 formed on the OP₀ plane (e.g., the self-image plane 408aligns with the OP₀ plane, as shown by equation ΔZ=0 mm).

FIG. 5A shows an image 500 generated of an object 310 using theconfiguration 400 (FIG. 4). The image 500 includes alternating dark andlight vertical lines 504, 506. The contrast of the vertical linesrepresents the different depths of the surface of a portion of theobject 310 being imaged. The fringes 502 of the image 500 are of highcontrast (e.g., include a range of bright highlights to dark shadows).The high contrast shows that the image 500 is a self-image. FIG. 5Bshows a graph 510 of the profile measured in a middle portion of theimage 500. As shown by the graph 510, the frequency of the profilemeasured changes as the contrast of the image 500 changes.

To determine whether the image 500 is a self-image, the processingdevice 2002 can move the first focal point 404 to a second focal point416, as shown in FIG. 4B. The second focal point 416 may be a distanceof several millimeters, less than one millimeter, or any other desireddistance from (e.g., in front of) the plane OP₀, and the change inlocation of the focal point is represented schematically by ΔZ in aconfiguration 410.

In comparison to the image 500 with the self-image plane 408, whichincludes the focal point 404, aligning with OP₀ plane (ΔZ=0 mm), FIGS.6A-B show an image 600 and a resulting graph 610 for a configuration 410having a distance of ΔZ=−5 mm between the self-image plane 408 and theOP₀ plane and FIGS. 6C-D show an image 620 and a resulting graph 630 fora configuration 410 having a distance of ΔZ=−10 mm between theself-image plane 408 and the OP₀ plane. As the distance of the focalpoint 416 from the OP₀ plane increases, the contrast of the fringes 602,622 decrease. For example, as the distance of the focal point 416 fromthe OP₀ plane increases from ΔZ=0 mm (image 500) to ΔZ=−5 mm (image 600)to ΔZ=−10 mm (image 620), the contrast decreases from the fringes 502 tothe fringes 602 to the fringes 622. Furthermore, the contrast of lines604 and 606 has decreased from lines 504, 506 (FIG. 5A). As contrastdecreases, less depth information can be obtained from the images. Asshown by the graphs 410, 610, and 630, the frequency of the profilesmeasured change as the contrast of the images change.

The processing device 2002 can change the grating density. As shown by aconfiguration 700 in FIG. 7A, the processing device 2002 can refocus theobjective lens 318 on the OP₀ plane (e.g., represented by the convergenttriangle with a vertex 704 in the OP₀ plane). The object 312 is observedon the OP₀ plane and a second grating of 100 lines/inch is used,resulting in a self-image 702 being formed a distance (ΔZ) from the OP₀plane (e.g., the self-image plane 708 does not align with the OP₀plane).

FIG. 8A shows the image 800 generated of the object 310 usingconfiguration 700 (FIG. 7A). Because the self-image is not formed on theOP₀ plane, the image of the grating is not in high contrast. The image800 does not have alternating dark and light vertical lines. FIG. 8Bshows the graph 810 of the profile measured in a middle portion of theimage. As shown by the graph 810, the frequency of the profile measuredchanges as the contrast of the image changes.

To improve the contrast, the processing device 2002 can move the vertexof the objective lens 318. FIG. 7B shows a configuration 710 with avertex 704 a distance ΔZ from the plane of observation (e.g., the OP₀plane). When the frequency changes (e.g., the density of the grating),the self-image may be formed at a distance ΔZ from the plane ofobservation. The focal point of vertex 704 can be moved to a self-imageplane 708, both of which are positioned a distance ΔZ from the OP₀plane. The self-image plane 708 and the vertex 704 do not match the OP₀plane. The resulting image 900 is shown in FIG. 9A. The image 900includes alternating dark and light vertical lines 904, 906. Thecontrast of the vertical lines represents the different depths of thesurface of a portion of the object 310 being imaged. The fringes 902 ofthe image 900 are of high contrast (e.g., include a range of brighthighlights to dark shadows). FIG. 9B shows the graph 910 of the profilemeasured in a middle portion of the image 900. As shown by the graph910, the frequency of the profile measured changes as the contrast ofthe image 900 changes.

Using the period of the fringes and the wavelength of the incidentradiation, the system 300 can determine the ΔZ displacement. The system300, via the processing device 2002, can determine the ΔZ displacementby using equation 1:

$\begin{matrix}{{\Delta Z} = {{Z_{T{({98})}} - Z_{T{({100})}}} = {\frac{2\left( d_{98} \right)^{2}}{\lambda} - \frac{2\left( d_{100} \right)^{2}}{\lambda}}}} & (1)\end{matrix}$

Equation 1 calculates the net displacement ΔZ of the self-image planerelative to the focal point (e.g., a focal plane). The displacement ΔZis equivalent to the axial distance over two positions on a surface(e.g., at the fringes) of the first and second gratings (e.g., theTalbot lengths with respect to the grating periods), which is alsoequivalent to the difference of 2 times the square of the slitseparation (e.g., the density of the grating (lines/inch)) of the firstgrating divided by the wavelength of the incident radiation (A) and 2times the square of the slit separation of the second grating divided bythe wavelength of the incident radiation (A).

For example, using equation 1, the resultant value of ΔZ in theconfiguration 710 is approximately 9 mm. The resultant value may be agreater or lesser displacement value. The examples provided herein arefor illustrative purposes and can be modified in accordance withembodiments of this disclosure.

Images on a Concave Surface

As illustrated in FIGS. 10-19, the systems and methods can be used tomeasure distances between portions of objects with curved surfaces. Thesystems and methods of this disclosure can be used to distinguish andmeasure distances in images between objects, such as objects 310 insidea patient's knee or any other desired body parts that are not flat. Suchimages include a surface with some curvature. The systems and methodsherein can be used to determine changes of a self-image 1008. FIG. 10shows a configuration 1000 with the objective lens 318 having a focalpoint 1002 to form a self-image in a curved surface 1006 (e.g., aconcave surface). The curved surface 1006 may be formed in a shapecomparable to the shape of an eggshell (e.g., a prolate spheroid) or anyother desired curved shape. A graph 1010 shows a position of theself-image 1008 with the vertex 1004 of the curved surface 1006converging at the focal point 1002. In this embodiment, the firstgrating 402 comprises a frequency of 98 lines/inch.

The processing device 2002 can be configured to detect variation incurvature of the object 310 in a first zone 1008, as shown by the upperrectangle. A low variation in curvature may result in a reducedvariations of contrast of the self-image 1008. If the processing device2020 detects a low variation in curvature, the processing device 2020can adjust the focal point (e.g., at vertex 1004) to move out of thefirst zone 1008 to a second zone 1012, as shown by the lower rectangle.In the second zone 1012, the detection area is moved to below the axis1014 (which, in this example, corresponds with the apex); as shownschematically in graph 1010.

When the system 300 captures an image for a flat surface, the image canhave similar results as the image captured at the axis 1014. Theresults, therefore are shown in FIGS. 4A and 4B. However, for a curved(e.g., concave) surface, the system 300 may be configured to detectadditional information and produce images with different results.

FIG. 11A shows an image 1100 observed on the curved surface 1006. Theimage 1100 has a high contrast; however, the frequency of the image 1100decreases as the surface curves, resulting in a loss of contrast asshown by fringes 1102. FIG. 11B shows a graph 1110 of the frequency of amiddle portion of the image 1100.

The system 300 can be configured to use different diffraction gratings.For example, the system 300 can use the first grating 502 with afrequency of 98 lines/inch, the second grating 702 with a frequency of100 lines/inch, or any other desired diffraction grating. FIG. 12 showsa schematic of the second grating 702 with the focus over the vertex ofthe surface in the second zone 1012. FIG. 13A shows an image 1300 with apattern of fringes 1302. The area near the self-image plane 708 hasimproved visibility, with loss towards the vertex area. In other words,the self-image includes a pattern of high contrast. FIG. 13B shows thecorresponding graph of a middle portion of the frequency of the image1300.

The second position of the self-image plane provides an axial measure ofthe second observation point on the curved surface 1006. The system 300can be configured to adjust the focus to match the position of thesecond self-image as is shown schematically by a line 1402 in FIG. 14.

As shown in FIG. 15A, image 1500 has a high-contrast fringe 1502. Thehigh-contrast fringes 1502 degrade toward the apex of the curved surface1006. The degradation effect on the fringes 1502 may result from thepresence of the curved surface (e.g., rather than from the focusingprocess).

The system 300 can be configured to focus the self-image plane of thesecond grating 702 (e.g., a frequency of 100 lines/inch). The system 300can remove the curved surface 1006 and substitute it with a flatsurface. In doing so, the high contrast can be provided across themeasurement area. In other words, the effect of progressive loss ofcontrast due to the presence of the curved surface is reduced.

The system 300 can detect the distance of the position of the vertex ofthe curved surface and use the flat surface detected in the position.FIG. 16A shows a diffraction pattern observed at the vertex of thecurved surface 1006 while the system 300 is focused at the secondgrating. The image 1600 exhibits low contrast. The loss of contrast maybe an effect of the curved surface.

The system 300 can evaluate the results of the contrast using differentgratings and/or at different focal points. The system 300 can applyequation 1 to calculate the axial position of the two points on thesurface being measured. The system 300 can determine the ΔZ displacementby using equation 2:

ΔZ=Z _(T(98)) −Z _(T(100))=9 mm  (2)

FIG. 17 shows schematically equation 2. The processing device 2020 canuse equation 2 to determine and measure the axial distance over twopositions on a surface. For example, the net displacement ΔZ of theself-image plane relative to the focal point (e.g., a focal plane) isequivalent to the axial distance over two positions on a surface (e.g.,at the fringes) of the first and second gratings. The processing device2002 can calculate the difference of the first and second positions ofthe self-image planes 408, 708 as observed in the zone 1012. Graph 1700shows that the distance between a vertex of lines 1402 and the vertex oflines 1404 (e.g., a distance of 9 mm).

The system 300 can be configured to measure an intermediate point (e.g.,a third position on the surface). The system 300 can use diffractiongratings with a finer variation in frequency. For example, the system300 may include the LCD with a pixel size of fewer than 10 microns.

As shown in FIG. 18, the system 300 may use gratings having differenttypes of detectable patterns. For example, the grating may be a Ronchigrating, for which the opening ratio is 0.5 or any other desired openingratio. The system 300 can use one or more gratings to generate two typesof detectable patterns, which unfold between two self-images: namelyZ_(T)/4, Z_(T)/2 and 3Z_(T)/4 (e.g., comparable to Z_(T)/4). Z_(T)represents the Talbot lengths.

The system 300 can be configured to measure a calibration matrix anddevelop a measurement algorithm. The system 300 can calculate theintermediate positions using contrast variation from the calibrationmatrix. The artificial intelligence engine and/or machine learningengine may be trained to measure the calibration matrix to develop themeasurement algorithm. The system 300 can vary the opening ratio of thediffraction gratings to a value different from ½. As shown in FIG. 19,when the system 300 varies the opening ratio, the number of identifiablepatterns (high contrast) increase. The schematic 1900 shows anilluminating plane wave 1902 traversing a grating 1904 to produce animage 1906 with identifiable patterns. The Talbot pattern is self-imagesof phase grating. The diffraction pattern repeats itself at the planesof integer multiple Talbot lengths. In this example, the patternsinclude a primary Talbot image 1908, a double-frequency fractional image1910, a secondary Talbot image 1912, and a triple frequency fractionalimage 1914. Depending on the value of the opening ratio, there may beadditional and/or fewer identifiable patterns. The system 300 can usethe identifiable patterns to generate 3-D images. The artificialintelligence engine and/or machine learning engine may be trained todetect and use the identifiable patterns to generate one or more 3-Dimages.

The system 300 can use the Talbot effect to detect changes in thecurvature of the object. The system 300 can conduct a Z-Scan using thedependence of the self-images positions along the propagation as afunction of A and d (see equation 1). The system 300 use the detectedcontrast of the pattern of fringes to determine the curvature of theobject and produce a 3-D image of the surface.

The system 300 can measure profiles of surfaces with regular curvature(e.g., with symmetry of revolution). The systems and methods describeherein can be applied to irregular surfaces without symmetry ofrevolutions. The system 300 can be configured to rotate the gratingaround the optical axis in order to analyze objects without circularsymmetry and obtain different measurements. The system 300 can use anLCD or any other desired display to vary the period of the diffractiongrating in real time. The system 300 can be configured to measure of thecontrast variation as a function of the wavelength of the incidentradiation, and maintaining fixed the period of the grating displayed bya LCD. For example, the system 300 may include a tunable laser in thevisible region. The system 300 may include additional and/or fewercomponents and are not limited by those disclosed herein.

Software and Hardware

FIG. 20 shows an example computer system 2000. In one example, computersystem 2000 may correspond to the surgical controller 118, a tabletdevice within the surgical room, or any other system that implements anyor all the various methods discussed in this specification. The computersystem 2000 may be connected (e.g., networked) to other computer systemsin a local-area network (LAN), an intranet, and/or an extranet (e.g.,device cart 102 network), or at certain times the Internet (e.g., whennot in use in a surgical procedure). The computer system 2000 may be aserver, a personal computer (PC), a tablet computer or any devicecapable of executing a set of instructions (sequential or otherwise)that specify actions to be taken by that device. Further, while only asingle computer system is illustrated, the term “computer” shall also betaken to include any collection of computers that individually orjointly execute a set (or multiple sets) of instructions to perform anyone or more of the methods discussed herein.

The computer system 2000 includes a processing device 2002, a mainmemory 2004 (e.g., read-only memory (ROM), flash memory, dynamic randomaccess memory (DRAM) such as synchronous DRAM (SDRAM)), a static memory2006 (e.g., flash memory, static random access memory (SRAM)), and adata storage device 2008, which communicate with each other via a bus2010.

Processing device 2002 represents one or more general-purpose processingdevices such as a microprocessor, central processing unit, or the like.More particularly, the processing device 2002 may be a complexinstruction set computing (CISC) microprocessor, reduced instruction setcomputing (RISC) microprocessor, very long instruction word (VLIW)microprocessor, or a processor implementing other instruction sets orprocessors implementing a combination of instruction sets. Theprocessing device 2002 may also be one or more special-purposeprocessing devices such as an application specific integrated circuit(ASIC), a field programmable gate array (FPGA), a digital signalprocessor (DSP), network processor, or the like. The processing device2002 is configured to execute instructions for performing any of theoperations and steps discussed herein. Once programmed with specificinstructions, the processing device 2002, and thus the entire computersystem 2000, becomes a special-purpose device, such as the surgicalcontroller 118.

The computer system 2000 may further include a network interface device2012 for communicating with any suitable network (e.g., the device cart102 network). The computer system 2000 also may include a video display2014 (e.g., display device 114), one or more input devices 2016 (e.g., amicrophone, a keyboard, and/or a mouse), and one or more speakers 2018.In one illustrative example, the video display 2014 and the inputdevice(s) 2016 may be combined into a single component or device (e.g.,an LCD touch screen).

The data storage device 2008 may include a computer-readable storagemedium 2020 on which the instructions 2022 (e.g., implementing anymethods and any functions performed by any device and/or componentdepicted described herein) embodying any one or more of themethodologies or functions described herein is stored. The instructions2022 may also reside, completely or at least partially, within the mainmemory 2004 and/or within the processing device 2002 during executionthereof by the computer system 2000. As such, the main memory 2004 andthe processing device 2002 also constitute computer-readable media. Incertain cases, the instructions 2022 may further be transmitted orreceived over a network via the network interface device 2012.

While the computer-readable storage medium 2020 is shown in theillustrative examples to be a single medium, the term “computer-readablestorage medium” should be taken to include a single medium or multiplemedia (e.g., a centralized or distributed database, and/or associatedcaches and servers) that store the one or more sets of instructions. Theterm “computer-readable storage medium” shall also be taken to includeany medium that is capable of storing, encoding or carrying a set ofinstructions for execution by the machine and that cause the machine toperform any one or more of the methodologies of the present disclosure.The term “computer-readable storage medium” shall accordingly be takento include, but not be limited to, solid-state memories, optical media,and magnetic media.

FIG. 21 shows a method of generating a 3-D image of an object inaccordance with at least some embodiments. In particular, the methodstarts (block 2100) and may comprise: transmitting a first light raythrough a first optical path along an optical axis of an optical channel(block 2102); transmitting a second light ray through a second opticalpath along the optical axis (block 2104); receiving a first set ofimages captured by an image sensor, wherein the first set of imagespertain to the first light ray (block 2106); receiving a second set ofimages captured from the image sensor, wherein the second set of imagespertain to the second light ray (block 2108); and generating, using thefirst and second sets of images, the 3-D image (block 2110). Thereafter,the example method ends. Portions of the example method may beimplemented by computer instructions executed with the processing device2002, such as the surgical controller 118 (FIG. 1), a microcontroller(e.g., an LCD), a micro-mirror array, or any other desired device.

FIG. 22 shows a method of generating a 3-D image of an object inaccordance with at least some embodiments. In particular, the methodstarts (block 2200) and may comprise: generating, using the second lightray, a grid pattern (block 2202); adjusting a density of the gridpattern (block 2204); and generating, using the grid pattern, the 3-Dimage (block 2206). Thereafter, the example method ends. Portions of theexample method may be implemented by computer instructions executed withthe processing device 2002, such as the surgical controller 118 (FIG.1), a microcontroller (e.g., an LCD), a micro-mirror array, or any otherdesired device.

FIG. 23 shows a method of rotating a display to generate a 3-D image ofan object in accordance with at least some embodiments. In particular,the method starts (block 2300) and may comprise: generating, using thesecond light ray, a grid pattern (block 2302); rotating the grid patternabout the optical axis (block 2304); generating, using the grid pattern,the 3-D image (block 2306). Thereafter, the example method ends.Portions of the example method may be implemented by computerinstructions executed with the processing device 2002, such as thesurgical controller 118 (FIG. 1), a microcontroller (e.g., an LCD), amicro-mirror array, or any other desired device.

FIGS. 21-23 are not intended to be limiting: the methods 2100, 2200, and2300 can include more or fewer steps and/or processes than thoseillustrated in FIGS. 21-23. Further, the order of the steps of themethods 2100, 2200, and 2300 is not intended to be limiting; the stepscan be arranged in any suitable order. Any or all of the steps ofmethods 2100, 2200, and 2300 may be implemented during a surgicalprocedure or at any other desired time.

Consistent with the above disclosure, the examples of systems and methodenumerated in the following clauses are specifically contemplated andare intended as a non-limiting set of examples.

Clause 1. A system for an endoscope, comprising:

a camera head coupled to an optical channel;

a light port coupled to the endoscope and configured to receive a firstlight ray, wherein the first light ray travels through a first opticalpath along an optical axis of the optical channel;

a depth measurement module coupled to the endoscope, wherein the depthmeasurement module is configured to transmit a second light ray througha second optical path along the optical axis;

an image sensor coupled to the camera head and configured to receive afirst set of images pertaining to the first light ray and a second setof images pertaining to the second light ray; and a processing deviceconfigured to receive the first and second sets of images from the imagesensor and use the first and second sets of images to generate one ormore three-dimensional (3-D) images.

Clause 2. The system of any clause, wherein the depth measurement modulecomprises:

a light source configured to transmit the second light ray;

an objective lens configured to collimate the second light ray;

a microcontroller configured to generate a grid pattern;

a Liquid Crystal Display (LCD) configured to display the grid pattern;and

a beam splitter configured to reflect at least a portion of the secondlight ray through the optical channel.

Clause 3. The system of any clause, wherein the processing device isfurther configured to generate, using the grid pattern, the one or more3-D images.

Clause 4. The system of any clause, wherein the microcontroller isconfigured to adjust at least one of a density of the grid pattern or arotation of the grid pattern displayed on the LCD.

Clause 5. The system of any clause, wherein the first optical path isdisposed at least between a distal end of the endoscope and the camerahead.

Clause 6. The system of any clause, wherein the first set of imagescomprise two-dimensional (2-D) images.

Clause 7. The system of any clause, wherein the second set of imagescomprise depth information.

Clause 8. The system of any clause, wherein the first and second lightrays comprise different portions of an electromagnetic spectrum.

Clause 9. The system of any clause, wherein the first light ray is awhite light and the second light ray is an ultraviolet (UV) ray or aninfrared ray.

Clause 10. The system of any clause, further comprising a second sensorconfigured to receive the second light ray.

Clause 11. The system of any clause, wherein the processing device isconfigured to use at least one of distortion and phase informationobtained from the second set of images to generate the one or more 3-Dimages.

Clause 12. The system of any clause, further comprising:

a micro-mirror array configured to generate a grid pattern, wherein theprocessing device is configured to generate, using the grid pattern, theone or more 3-D images.

Clause 13. The system of any clause, wherein the processing device isconfigured to generate, via an artificial intelligence engine, a machinelearning model trained to adjust at least one of a density of a gridpattern or a rotation of the grid pattern displayed on an LCD.

Clause 14. A method of generating a three-dimensional (3-D) image of anobject, comprising:

transmitting a first light ray through a first optical path along anoptical axis of an optical channel;

transmitting a second light ray through a second optical path along theoptical axis;

receiving a first set of images captured by an image sensor, wherein thefirst set of images pertain to the first light ray;

receiving a second set of images captured from the image sensor, whereinthe second set of images pertain to the second light ray; and

generating, using the first and second sets of images, the 3-D image.

Clause 15. The method of any clause, further comprising:

generating, using the second light ray, a grid pattern;

rotating the grid pattern about the optical axis; and

generating, using the grid pattern, the 3-D image.

Clause 16. The method of any clause, further comprising:

generating, using the second light ray, a grid pattern;

adjusting a density of the grid pattern; and

generating, using the grid pattern, the 3-D image.

Clause 17. The method of any clause, further comprising:

generating, via an artificial intelligence engine, a machine learningmodel trained to generate image data based on at least one of the firstand second sets of images and a grid pattern.

Clause 18. The method of any clause, wherein the first optical path anda section of the second optical path are disposed in the opticalchannel.

Clause 19. A system for an endoscope, comprising:

a camera head coupled to an optical channel;

a light port coupled to the endoscope and configured to receive a firstlight ray, wherein the first light ray travels through a first opticalpath along an optical axis of the optical channel;

a depth measurement module coupled to the endoscope, wherein the depthmeasurement module is configured to generate a grid pattern and transmitthe grid pattern and a second light ray toward a beam splitter, whereinthe beam splitter is configured to reflect at least a portion of thegrid pattern and the second light ray through the optical axis;

an image sensor configured to receive a first set of images capturedfrom the camera, wherein the first set of images pertain to the firstlight ray;

a second image sensor configured to receive a second set of imagescaptured from the camera, wherein the second set of images pertain tothe second light ray; and

a processing device configured to receive the first and second sets ofimages and the grid pattern from the image sensors and use the first andsecond sets of images and the grid pattern to generate one or morethree-dimensional (3-D) images.

Clause 20. The system any clause, wherein the processing device isconfigured to generate, via an artificial intelligence engine, a machinelearning model trained to generate image data based on at least one ofthe first and second sets of images and the grid pattern.

Consistent with the above disclosure, the examples of assembliesenumerated in the following clauses are specifically contemplated andare intended as a non-limiting set of examples.

The above discussion is meant to be illustrative of the principles andvarious embodiments of the present invention. Numerous variations andmodifications will become apparent to those skilled in the art once theabove disclosure is fully appreciated. It is intended that the followingclaims be interpreted to embrace all such variations and modifications.

What is claimed is:
 1. A system for an endoscope, comprising: a camera head coupled to an optical channel; a light port coupled to the endoscope and configured to receive a first light ray, wherein the first light ray travels through a first optical path along an optical axis of the optical channel; a depth measurement module coupled to the endoscope, wherein the depth measurement module is configured to transmit a second light ray through a second optical path along the optical axis; an image sensor coupled to the camera head and configured to receive a first set of images pertaining to the first light ray and a second set of images pertaining to the second light ray; and a processing device configured to receive the first and second sets of images from the image sensor and use the first and second sets of images to generate one or more three-dimensional (3-D) images.
 2. The system of claim 1, wherein the depth measurement module comprises: a light source configured to transmit the second light ray; an objective lens configured to collimate the second light ray; a microcontroller coupled to a Liquid Crystal Display (LCD), the microcontroller and LCD configured to generate a grid pattern; and a beam splitter configured to direct at least a portion of the second light ray through the optical channel.
 3. The system of claim 2, wherein the processing device is further configured to generate, using the grid pattern, the one or more 3-D images.
 4. The system of claim 2, wherein the microcontroller is configured to adjust at least one of a density of the grid pattern or a rotation of the grid pattern displayed on the LCD.
 5. The system of claim 1, wherein the second optical path is disposed at least between a distal end of the endoscope and the camera head.
 6. The system of claim 1, wherein the first set of images comprise two-dimensional (2-D) images.
 7. The system of claim 1, wherein the second set of images comprise depth information.
 8. The system of claim 1, wherein the first and second light rays comprise different portions of an electromagnetic spectrum.
 9. The system of claim 1, wherein the first light ray is a white light and the second light ray is an ultraviolet (UV) ray or an infrared ray.
 10. The system of claim 9, further comprising a second sensor configured to receive the second light ray.
 11. The system of claim 1, wherein the processing device is configured to use at least one of distortion and phase information obtained from the second set of images to generate the one or more 3-D images.
 12. The system of claim 1, further comprising: a micro-mirror array configured to generate a grid pattern, wherein the processing device is configured to generate, using the grid pattern, the one or more 3-D images.
 13. The system of claim 1, wherein the processing device is configured to generate, via an artificial intelligence engine, a machine learning model trained to adjust at least one of a density of a grid pattern or a rotation of the grid pattern displayed on an LCD.
 14. A method of generating a three-dimensional (3-D) image of an object, comprising: transmitting a first light ray through a first optical path associated with an optical axis of an optical channel; transmitting a second light ray through a second optical path associated with along the optical axis; receiving a first set of images captured by an image sensor, wherein the first set of images pertain to the first light ray; receiving a second set of images captured from the image sensor, wherein the second set of images pertain to the second light ray; and generating, using the first and second sets of images, the 3-D image.
 15. The method of claim 14, further comprising: generating, using the second light ray, a grid pattern; rotating the grid pattern about the optical axis; and generating, using the grid pattern, the 3-D image.
 16. The method of claim 14, further comprising: generating, using the second light ray, a grid pattern; adjusting a density of the grid pattern; and generating, using the grid pattern, the 3-D image.
 17. The method of claim 14, further comprising: generating, via an artificial intelligence engine, a machine learning model trained to generate image data based on at least one of the first and second sets of images and a grid pattern.
 18. The method of claim 14, wherein the first optical path and a section of the second optical path are disposed in the optical channel.
 19. A system for an endoscope, comprising: a camera head coupled to an optical channel; a light port coupled to the endoscope and configured to receive a first light ray, wherein the first light ray travels through a first optical path along an optical axis of the optical channel; a depth measurement module coupled to the endoscope, wherein the depth measurement module is configured to generate a grid pattern and transmit the grid pattern and a second light ray toward a beam splitter, wherein the beam splitter is configured to reflect at least a portion of the grid pattern and the second light ray through the optical axis; an image sensor configured to receive a first set of images captured from the camera, wherein the first set of images pertain to the first light ray; a second image sensor configured to receive a second set of images captured from the camera, wherein the second set of images pertain to the second light ray; and a processing device configured to receive the first and second sets of images and the grid pattern from the image sensors and use the first and second sets of images and the grid pattern to generate one or more three-dimensional (3-D) images.
 20. The system of claim 19, wherein the processing device is configured to generate, via an artificial intelligence engine, a machine learning model trained to generate image data based on at least one of the first and second sets of images and the grid pattern. 